Defektoskopiâ
ISSN 0130-3082 (Print)
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Keywords
Coherence Factor (CF)
Full Matrix Capture (FMC)
Total Focusing Method (TFM)
acoustic emission
antenna array
coercive force
corrosion
defect
eddy current testing
flaw detection
hardness
image processing
infrared thermography
modeling
non-destructive testing
nondestructive testing
standing waves
thermal testing
thermography
ultrasonic testing
ultrasound
Current Issue
No 4 (2025)
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Keywords
Coherence Factor (CF)
Full Matrix Capture (FMC)
Total Focusing Method (TFM)
acoustic emission
antenna array
coercive force
corrosion
defect
eddy current testing
flaw detection
hardness
image processing
infrared thermography
modeling
non-destructive testing
nondestructive testing
standing waves
thermal testing
thermography
ultrasonic testing
ultrasound
Current Issue
No 4 (2025)
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For Authors
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Author Details
Author Details
Vavilov, V. P.
Issue
Section
Title
File
No 5 (2024)
Thermal methods
Thermal nondestructive testing of cracks in turbine blades by using ultrasonic stimulation
No 3 (2024)
Comprehensive application of non-destructive testing methods
Applying data fusion procedures to evaluation of impact damage in carbon fiber reinforced plastic by using optical infrared thermography and laser vibrometry techniques
No 2 (2024)
Acoustic methods
Analysis and NDT applications of a gas discharge electroacoustic transducer
No 11 (2024)
Comprehensive application of non-destructive testing methods
Data fusion of ultrasonic and thermal nondestructive testing of metal-polymer composite
No 9 (2024)
Thermal methods
Thermal testing of corundum ceramics: pulse heating and optimized data processing algorithms
No 8 (2024)
Thermal methods
Evaluating efficiency of foreign object detection technology based on the use of passive infrared thermography
No 7 (2024)
Thermal methods
Evaluating water ingress in glass fiber plastic/Nomex honeycomb panels under varying panel orientation
No 7 (2024)
Thermal methods
Thermal testing of corundum ceramics: Classical techniques for optical heating
No 4 (2025)
Thermal methods
Infrared Thermal Imaging Detection and Image Segmentation of Micro-Crack Defects in Semiconductor Silicon Wafer Scanned by Laser
No 4 (2025)
Defectoscopy Stories
“Warm” Flaw Detection Stories
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